Surface Mount Technology System   
 
 
High-speed Modular Mounter FX-2

Introducing a new 2 head, 12 nozzle design Placement speed increased by 20%. *1

     
Features
A high-speed modular mounter with production capacity increased by 20%, ?1 improved economical efficiency, operations, and reliability.
40,000CPH (Optimum) (0.09 sec/chip) ?2
30,000CPH (IPC9850) ?2
Two multi laser heads (12 nozzles)
Component size: from 0402 (01005) to 33.5mm square
*1 Compared with previous mode
*2 Actual throughput may vary
     
Specifications
Board size
L size (410×360mm)
Component height
6mm
Component size
0402 (01005)~?33.5mm
Placement speed (chip)
Chip
Optimum
0.09Sec./chip (40,000CPH)
IPC9850
30,000CPH
Placement accuracy (Laser recognition)
±0.05mm ( ±3s )
Feeder inputs
Max. 80 on 8mm T/F
 
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